IDF Day 1 Recap: Ivy Bridge, and the X79 Factor in Photos

Did you miss yesterday's Intel Developer Forum announcements? Take hold of up in our day one recap–and take our previous IDF coverage here.

A great deal of the Intel Developer Forum's first day was spent talking about Ivy Bridge, Intel's future multiplication Central processor built on the upcoming 22nm tri-gate process technology. Normally, Ivy Bridge would be the "tick" in Intel's "tick-tock" model of central processing unit product evolution. The "tick" refers to moving to a fresh, higher density process applied science. When Intel does that, the first CPU ware it builds on the new manufacturing process, is usually a tweaked and enhanced interpretation of an existing CPU architecture. The "tock" is when Intel, now well-heeled with a new cognitive operation, designs a untried architecture, and then builds it on the now familiar process.

On the x86 Mainframe side, Intel pretty much did just that with Ivy Bridge. There will be some performance improvements concluded the alive Beachlike Bridge computer architecture, but those wish personify incremental. Power efficiency is promising to be considerably better, however.

Much of the emphasis on Ivy Bridge is in mogul efficiency. The CPU will enable DDR I/O power gating, configurable TDP (thermal design power) and power-sensitive disrupt pairing. Configurable TDP is fascinating in that current Intel CPUs offer a unwed thermal design superpowe luff. Configurable TDP will allow system makers to design a single CPU into a variety of form factors, including cases that Crataegus oxycantha offer limited cooling, without sacrificing base level performance. In addition, Ivy Bridge circuit will support DDR3L, the new low potential dro DDR3 standard running at 1.35v.

Intel is improving overclocking capabilities, increasing the maximum multiplier factor ratio support from 57 to 63. Another fascinating change is dynamic overclocking, lease users change clock speed through software system without rebooting the system.

Intel also added a original digital random number generator that's purportedly much more robust and and much speedier than electric current methods. Besides added is Supervisor Mode Execution Protection, a hardware technique to preclude malware from jumping across hardware security measures levels at bottom the CPU.

Intel's Ivy Bridge GPU will be fully DirectX 11 compliant and easily scalable.

However, the GPU broadside is more like a "tock". The art core built into Ivy Bridge will exist substantially improved over the topical Intel HD Graphics in Light Bridge. It will be in full DirectX 11 compliant – to the point of being able to melt calculate shaders in writing for DirectCompute wholly on the shaders well-stacked into the Hedera helix Bridge GPU.

Intel's Tom Piazza headed the conception effort for the Ivy Bridge GPU.

Intel Precedential Fellow and graphics architect Tom Piazza discussed the new graphics Congress of Racial Equality at some length. The key factors to the design include adding earthshaking geometry and tessellation horsepower to fully support DX11. The core is highly ascendable, with functional "slices" and "slice green" able to be built for diverse CPU product needs. Rather of the two variants you see today for Intel HD Graphics, you may see a number of different versions.

The designers also added an L3 cache to the GPU itself. To boot to operation improvements, the cache also helps power efficiency, since anything located in the lay away means the CPU ring bus doesn't need to beryllium fired up. Execution units have been increased, most importantly by extending the co-issue of operations to galore more than instructions than Sandy Bridge's graphics core was capable of.

Boilers suit, Piazza estimates reduplicate the overall throughput of the gist, compared to Sandy Bridge GPUs, merely some areas may see even greater performance increases, while achieving the goal of greater power efficiency. Will an integrated GPU from Intel at long last flummox some respect from gamers? Solitary metre will tell.

Hedera helix Bridge products are slated to ship sometime in the first half of 2020, but further details on product models and clock speeds aren't celebrated.

The Intel Showcase and the X79 Factor

Intel always has a trade prove in small at IDF, mostly highlight partner products using Intel technology. Piece Common ivy Span is stimulating, information technology's a few months out. Most of the actual product attention is on Sandlike Nosepiece Extreme, which will be a new high remnant Processor from Intel replacement the current Gulftown six pith processors, like the Core i7 990X. Sandy Bridge Extremum will send late in 2011.

Sandy Bridge Extreme, oftentimes abbreviated South by east, will require a newborn chipset and socket. The socket, dubbed LGA2011, will replace the senescent LGA1366. The chipset is the X79 chipset. SbE and the chipset together will abide four channels of DDR3 memory. Let's look at few X79 boards.